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RGE Selection Guide and Product Data
This section has two parts: * A Selection Guide that walks you through the process of selecting the correct RGE device for a circuit. * Product Data that outlines electrical characteristics, physical characteristics, agency recognitions, environmental specifications, component layouts, tape and reel specifications, and ordering information for RGE devices.
RGE Selection Guide
Follow these seven steps to select a PolySwitch RGE device for a circuit: 1. Define the operating parameters for the circuit. These include: * Maximum ambient operating temperature * Normal operating current * Maximum operating voltage (RGE is 16 V maximum) * Maximum interrupt current 2. Select the RGE device that accommodates the circuit's maximum ambient operating temperature and normal operating current. 3. Compare the RGE device's maximum operating voltage and maximum interrupt current with the circuit's to be sure the circuit does not exceed the device ratings. 4. Check the RGE device's time-to-trip be to sure it will protect the circuit. 5. Verify that the circuit's ambient operating temperatures are within the RGE device's operating temperature range. 6. Verify that the RGE device's dimensions fit the application's space considerations. 7. Independently evaluate and test the suitability and performance of the RGE device in the application.
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(R)
(R)
TUV Rheinland
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1. Define the circuit's operating parameters.
Fill in the following information about the circuit: Maximum ambient operating temperature Normal operating current Maximum operating voltage (RGE is 16 V max.) Maximum interrupt current ______________ ______________ ______________ ______________
2. Select the PolySwitch RGE device that will accommodate the
circuit's maximum ambient operating temperature and normal operating current. Look across the top of the table below to find the temperature that most closely matches the circuit's maximum ambient operating temperature. Look down that column to find the value equal to or greater than the circuit's normal operating current. Now look to the far left of that row to find the part number for the RGE device that will best accommodate the circuit. The thermal derating curve located on the next page is a normalized representation of the data in the table below. IHold vs. temperature
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Part number RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
Maximum ambient operating temperatures (C) -40 -20 0 20 25 4.4 4.0 3.6 3.1 3.0 5.9 5.3 4.8 4.1 4.0 7.3 6.6 6.0 5.2 5.0 8.8 8.0 7.2 6.2 6.0 10.3 9.3 8.4 7.3 7.0 11.7 10.7 9.6 8.3 8.0 13.2 11.9 10.7 9.4 9.0 14.7 13.3 12.0 10.3 10.0 16.1 14.6 13.1 11.5 11.0 17.6 16.0 14.4 12.4 12.0 20.5 18.7 16.8 14.5 14.0
40 2.6 3.5 4.4 5.2 6.2 6.9 7.9 8.7 9.7 10.4 12.1
50 2.4 3.2 4.0 4.8 5.6 6.4 7.2 8.0 8.8 9.6 11.2
60 2.1 2.8 3.6 4.2 5.0 5.6 6.4 7.0 7.8 8.4 9.8
70 1.9 2.5 3.1 3.8 4.4 5.1 5.6 6.3 6.9 7.6 8.9
85 1.4 1.9 2.4 2.8 3.3 3.7 4.2 4.7 5.2 5.6 6.5
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Thermal derating curve
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200
Percent of rated hold and trip current
150 100 50 0 -40
-20
0
20
40
60
80
Device's ambient temperature (C)
3. Compare maximum operating voltages and maximum
interrupt currents. Look down the first column of the table below to find the part number you selected in Step 1. Look to the right in that row to find the device's maximum operating voltage (V max.) and maximum interrupt current (I max.). Compare both ratings with the circuit's to be sure the circuit's ratings do not exceed those of the RGE device.
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Maximum device voltages and currents*
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Part number RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
V max. (volts) 16 16 16 16 16 16 16 16 16 16 16
I max. (amps) 100 100 100 100 100 100 100 100 100 100 100
*Device may withstand higher interrupt current at lower voltages. Each application will need to be individually qualified.
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4. Determine time-to-trip.
Time-to-trip is the amount of time it takes for a device to switch to a high-resistance state once a fault current has been applied across the device. Identifying the RGE device's time-to-trip is important in order to provide the desired protection capabilities. If the device you choose trips too fast, undesired or nuisance tripping will occur. If the device trips too slowly, the components being protected may be damaged before the device switches to a high-resistance state. The chart below shows the typical time-to-trip at 25C for each PolySwitch RGE device. For example, the chart indicates that the typical time-to-trip for RGE500 at 10 A is 10 seconds. On the chart below, find the typical time-to-trip for the RGE device you selected. If the RGE device's time-to-trip is too fast or too slow for the circuit, go back to Step 2 and choose an alternate device.
Typical time-to-trip at 25C
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Time-to-trip (s)
A= B= C= D= E= F= G= H= I= J= K=
RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
1000
A
B C D E FG H I J K
100
10
1
0
.01
.001
1
10 Fault current (A)
100
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Ensure that your application's minimum and maximum ambient temperatures are within the operating temperature range of -40C and 85C. Maximum device surface temperature in the tripped state is 125C.
Radial Leaded
6. Verify the RGE device's dimensions.
Using dimensions from the table below, compare the dimensions of the RGE device you selected with the application's space considerations.
Product dimensions (millimeters/inches)
Part number
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A max. 7.1 8.9 10.4 10.7 11.2 12.7 14.0 16.5 17.5 17.5 27.9
B max. 11.0 12.8 14.3 17.1 19.7 20.9 21.7 24.1 26.0 28.0 27.9
C typ. 5.1 5.1 5.1 5.1 5.1 5.1 5.1 5.2 5.1 10.2 10.2
D min. 7.6 7.6 7.6 7.6 7.6 7.6 7.6 7.6 7.6 7.6 7.6
E max. 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.6 3.4
F typ. 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.4 1.4
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RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
(0.28) (0.35) (0.41) (0.42) (0.44) (0.50) (0.55) (0.65) (0.69) (0.69) (1.10)
(0.43) (0.50) (0.56) (0.67) (0.78) (0.82) (0.85) (0.95) (1.02) (1.10) (1.10)
(0.20) (0.20) (0.20) (0.20) (0.20) (0.20) (0.20) (0.20) (0.20) (0.40) (0.40)
(0.30) (0.30) (0.30) (0.30) (0.30) (0.30) (0.30) (0.30) (0.30) (0.30) (0.30)
(0.12) (0.12) (0.12) (0.12) (0.12) (0.12) (0.12) (0.12) (0.12) (0.14) (0.13)
(0.05) (0.05) (0.05) (0.05) (0.05) (0.05) (0.05) (0.05) (0.05) (0.06) (0.06)
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RGE300-RGE1400* Lead Size RGE300-RGE1100 0.81 (0.032) 20 AWG RGE1200-RGE1400 1.0 (0.040) 18 AWG
C
C L C L CC LL
A
E
* Kinked leads are available for RGE300 - RGE1400
Marking
B
D
F
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RGE Product Data
Now that you have selected your RGE device, please review the device's characteristics in this section to verify that the device will perform as required. Electrical characteristics (25C)
Initial resistance R min. () 0.034 0.020 0.014 0.009 0.006 0.005 0.004 0.003 0.003 0.002 0.002 Post-trip resistance R1 max . () 0.105 0.063 0.044 0.030 0.021 0.018 0.015 0.012 0.010 0.009 0.008
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Part Number RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
IH (A) 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 14.0
IT (A) 5.1 6.8 8.5 10.2 11.9 13.6 15.3 17.0 18.7 20.4 23.8
Max. time to trip (s) at 5 x IH 2.0 3.5 3.6 5.8 8.0 9.0 12.0 12.5 13.5* 16.0 20.0
Pd (W) 2.3 2.4 2.6 2.8 3.0 3.0 3.3 3.3 3.7 4.2 4.6
IH = Hold current--maximum current at which the device will not trip at 25C. IT = Trip current--minimum current at which the device will always trip at 25C. Pd = Typical power dissipation--typical amount of power dissipated by the device when in tripped state in 25C still air. R min. = Minimum device resistance at 25C prior to tripping. R max. = Maximum device resistance at 25C prior to tripping. R1 max. = Maximum device resistance at 25C measured 1 hour post trip. * Device tested at 60 A.
Physical characteristics
Lead material Soldering characteristics
Insulating material
RGE300--RGE1100: Tin lead-plated copper, 20 AWG, 0.81 mm/0.032 in RGE1200--RGE1400: Tin lead-plated copper, 18AWG, 1.0 mm/0.04 in Solderability per ANSI/J-STD-002 Solder heat withstand per IEC 68-2-20: RGE300, Test Tb; should be soldered to the printed circuit in less than 4 seconds at maximum temperature of 260C 5. RGE500--RGE1400, Test Tb; can withstand 10 seconds at 260C 5. Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
Note: Devices are not designed to be placed through a reflow process.
Agency recognitions
CSA TUV UL
File # CA 78165C Certificate # R9677540 File # E74889
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Environmental specifications
Radial Leaded
Test Passive aging Humidity aging Thermal shock Solvent resistance
Test method Raychem PS300 Raychem PS300 Raychem PS300 Raychem PS300, Method 215
Conditions -40C, 1000 hours 85C, 1000 hours 85C, 85% R.H., 1000 hours 85C, -40C (10 times) MIL-STD-202, Method 215F
Resistance change 5% 5% 5% 5% No change
Component layouts The dimensions in the table below provide the component layout for each RGE device.
Component layout dimensions (millimeters/inches)
B
A B
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Device RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
A nom. 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 5.1 (0.20) 10.2 (0.40) 10.2 (0.40)
B max. 1.2 (0.05) 1.4 (0.06) 1.6 (0.06) 1.6 (0.06) 1.7 (0.07) 1.8 (0.07) 2.0 (0.08) 2.0 (0.08) 2.4 (0.09) 1.5 (0.06) 1.9 (0.07)
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RGE tape and reel specifications (dimensions in millimeters)
Product availability: RGE300-RGE700 (consult factory for higher hold current parts). Devices taped using EIA468-B/IEC286-2 standards. See table below and Figures 1 and 2 for details. Dimension description Carrier tape width Hold down tape width Top distance between tape edges Sprocket hole position Sprocket hole diameter Abscissa to plane (straight lead)* Abscissa to top RGE300 - RGE600 Abscissa to top RGE700* Overall width w/lead protrusion RGE300 - RGE600 Overall width w/lead protrusion RGE700 Overall width w/o lead protrusion Lead protrusion Protrusion of cut-out Protrusion beyond hold-down tape Sprocket hole pitch Device pitch Pitch tolerance Tape thickness Tape thickness with splice* Splice sprocket hole alignment Body lateral deviation Body tape plane deviation Ordinate to adjacent component lead* Lead spacing* Reel width RGE300-RGE500 Reel width RGE600-RGE700* Reel diameter Space between flanges less device* Arbor hole diameter Core diameter* Box Consecutive missing places Empty places per reel
*Differs from EIA specification
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EIA mark W W4 W6 W5 D0 H H1 H1 C1 C1 C2 L1 L l2 P0
IEC mark W W0 W2 W1 D0 H H1 H1
C1 I1 L l2 P0
t t1
h p P1 F w2 w2 a w1 c n
t
h p P1 F w w d
f h
Dimensions Dim. (mm) 18 11 3 9 4 18.5 32.2 36 43.2 46 42.5 1.0 11 Not specified 12.7 12.7 20 consec. 0.9 2.0 0 0 0 3.81 5.08 56 63.5 370 4.75 26 91 56/372/372 None 0.1% max.
Tol. (mm) -0.5/+1.0 min. max. -0.5/+0.75 0.2 3.0 max. max. max. max. max. max. max. 0.3 1 max. max. 0.3 1.0 1.3 1.0 0.8 max. max. max. 3.25 12.0 max. max.
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Figure 1: EIA Referenced Taped Component Dimensions
h h p
Radial Leaded
p
Reference plane
H1 L
P1 F
A B
H1 C1 H C2 H0 W4 W5 W
I2 L1 P0 D0
Direction of unreeling Cross section A - B t
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Figure 2: Reel Dimensions
Reel
n
a
Direction of unreeling
Upper side
Tape
Lower side
c
w1 w2
Cross section Optional shape: Circular or polygonal
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Ordering information
Product description RGE300 RGE300-2 RGE300-AP RGE400 RGE400-2 RGE400-AP RGE500 RGE500-2 RGE500-AP RGE600 RGE600-2 RGE600-AP RGE700 RGE700-2 RGE700-AP RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400
*Consult Factory
Bag quantity 500
Tape and reel AMMO quantity pack 2500 2000
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500 2500 2000 500 2000 2000 500 2000 2000 500 1500 500 500 500 500 500 500 * 1500 *
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*
*
*
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* * *
* * *
Standard package 10000 12500 10000 10000 12500 10000 10000 10000 10000 10000 10000 10000 10000 7500 7500 10000 10000 5000 5000 5000 5000
Part numbering system
RGE
suffix Blank -2 -AP -1 K = Packaged in bags = Tape and reel = AMMO pack = 25.4-mm (1.0-inch) minimum lead length = Kinked leads
Current rating
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Part marking system V V - 16 Voltage rating Raychem symbol G Part ID
Example
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V 16 G500 MN8F
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V
Product family (RGE)
Lot number/Date code (may be on the back)
Part description RGE300 RGE400 RGE500 RGE600 RGE700 RGE800 RGE900 RGE1000 RGE1100 RGE1200 RGE1400 Part ID 300 400 500 600 700 800 900 1000 1100 1200 1400
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WARNING:
* Operation beyond maximum ratings or improper use may result in device damage and possible electrical arcing and flame. * These devices are intended for protection against occasional overcurrent or overtemperature fault conditions, and should not be used when repeated fault conditions are anticipated. * Operation in circuits with inductive spikes can generate voltages above the rated voltage of the devices and should be evaluated for suitability.
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